The products are widely used in power supply, industrial control frequency conversion,
power instrument, automobile, communication and digital consumer electronics
| Our Capabilities and Technology | |||
| Items | 2022 | 2023 | |
| Layers | (MP):22layer，(Sampling)：32 layer | (MP)：32layer | |
| Max. Board THK | Sampling 4.0mm / MP ：3.2mm | Sampling 5.0mm / MP：3.2mm | |
| Min. Board THK | Sampling :0.4mm /MP :0.5mm | Sampling: 0.3mm / MP:0.4mm | |
| Base copper | Inner layer | 1/3 ～ 6 OZ | 1/3～8 OZ |
| Outer layer | 1/3 ～ 6 OZ | 1/3～8 OZ | |
| Base copper | Min.PTH | 0.2mm | 0.15mm |
| Max. aspect ratio | 10:01 | 12:01 | |
| HDI aspect ratio | 0.8:1 | 1:01 | |
| Tolerances | PTH | ±0.076mm | ±0.05mm |
| NPTH | ±0.05mm | ±0.03mm | |
| Solder mask opening | 0.05mm | 0.03mm | |
| Solder dam | (Green) 0.076mm , | (Green) 0.076mm , | |
| (other color) 0.1mm | (other color) 0.08mm | ||
| Min. core THK. | 0.1mm | 0.08mm | |
| Bow&twist | ≤0.5% | ≤0.5% | |
| Routing Tol. | Sampling :±0.075mm /MP：±0.1mm | Sampling:±0.075mm /MP：±0.075mm | |
| Impedance Tol. | ±10% | ±8% | |
| Min. w/s (Inner layer) | 0.075 / 0.075mm | 0.075 / 0.075mm | |
| Min. w/s (Outer layer) | 0.075 / 0.075mm | 0.075 / 0.075mm | |
| (Min. BGA size) | 0.2mm | 0.15mm | |
| （pitch）(Min. BGA Pitch) | 0.65mm | 0.5mm | |
| (Working panel size) | 600mm*700mm | 600mm*700mm | |
| Special process | Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. | ||
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